Chip Design

What Chips We Design

Versatile MOSFETs

Emphasizes the wide applicability in consumer electronics, IoT, and low-voltage automotive systems (30V-250V, RDS(on) 0.5–20mΩ).

Efficient SJ MOSFETs

Highlights the high-voltage efficiency and ultra-low RDS(on) (20–600mΩ) for renewables and industrial applications (650V–800V).

Robust IGBTs

Reflects the high-voltage (650V–3300V, developing 4500V–6500V) and reliable performance in motor drives and smart grids.

High – Performance SiC

Captures the superior efficiency and thermal resilience (650V–1200V, RDS(on) 20–80mΩ) for EVs and harsh environments.

Compact GaN

Underscores the small size and high-frequency capabilities (100V–650V, RDS(on) 15–50mΩ) for 5G and fast chargers.

WORK PROCESS

Our chip design process is a meticulous journey from concept to production, tailored to meet the highest industry standards. Here’s how we bring your integrated circuits to life:

Requirements Gathering and Specification

We engage with you to understand the chip’s intended functionality, performance metrics, and application needs, defining key parameters like power consumption and interface requirements.

Architecture Design

Our engineers craft a high-level architecture, focusing on modularity, scalability, and system integration.

RTL Design and Verification

Using industry-standard tools, we create and verify the Register Transfer Level (RTL) code through simulation and formal verification to ensure accuracy.

Physical Design (Layout)

This phase involves floor planning, placement, and routing, optimizing the design for area, power, and timing constraints.

Tape-Out

We finalize the design files and send them to our trusted foundry partners for fabrication.

Fabrication

Leveraging cutting-edge process technologies, we manufacture the chips with precision and quality.

Testing and Packaging

Post-fabrication, each chip undergoes extensive testing—functional, burn-in, and reliability assessments—before being packaged for delivery.

We design advanced power device chips and manufacture high-performance semiconductor devices for applications in energy, mobility, industrial machinery, and consumer products.

We guide our clients through difficult issues, bringing our insight and judgment to each situation. Our innovative approaches create original solutions to our clients

By thinking on behalf of our clients every day, we anticipate what they want, provide what they need
& build lasting relationships. These are the concept that shape our distinctive culture & differentiate us from others.

We guide our clients through difficult issues, bringing our insight and judgment to each situation. Our innovative approaches create original solutions to our clients

// CLIENTS TESTIMONIAL

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Design and Manufacturing Timeline Chips

Total Timeline: 11 weeks+

1 W

Analyzing Requirements

1 W

Design Phase

Specification, architecture, RTL, verification, synthesis, Layout, sign-off.

1 W

Prototyping

Validate design using FPGA or emulation.

1 W

Tape-out

Finalize design, send GDSII files (including layout) to foundry.

5 W

Fab Manufacturing

Create photomasks and use masks for wafer fabrication, wafer testing.

2 w+1000h

Assembly and Test

Die preparation, packaging, final testing. 1000h reliability tests mandatory for first batch

1 W+

Delivery

Ship finished chips to customers.

Design and Manufacturing Timeline Chips

Total Timeline: 8 weeks+

7 W

Mass Production

Start from fab Manufacturing to assembly and test

1 W+

Delivery

Ship finished chips to customers.